PCB Reflow soldering, SMT fixtures
Reflow soldering is the most commonly used method for bonding electronic components to printed circuit boards using surface mount technology (SMT). Another method is to connect electronic components through through-hole mounting (THT). Through-hole mounting involves filling existing holes on the circuit board with solder paste, inserting pins into the solder paste, and embedding electronic components into the board for soldering. Since wave soldering is cheaper and simpler, reflow soldering is basically not used on through-hole mounting circuit boards. When used on circuit boards containing both SMT and THT components, through-hole reflow soldering can replace wave soldering and effectively reduce assembly costs. PCB Reflow soldering, SMT fixtures
The purpose of the reflow soldering process is to gradually melt the solder and slowly heat the connection interface to avoid damage to electronic components caused by rapid heating. In the traditional reflow soldering process, it is usually divided into four stages, called "zones", and each zone has its own temperature curve: "preheating", "heat soaking", "reflow" and "cooling".
PCB Reflow soldering, SMT fixtures
